Case Study

High-Speed Mixer – High-Precision Uniform Dispersion Solution for Electronic Ceramic Powders
Industry
High-end electronic component manufacturing

Application Scenario
Powder pre-mixing process for aluminum nitride (AlN) ceramic substrates, applied to heat dissipation substrates of 5G communication high-frequency power devices.

Core Pain Points
A leading electronic ceramic enterprise encountered critical problems with the traditional dry mixing process during the production of aluminum nitride substrates:
Uneven dispersion: Nano-scale AlN powder (D50=0.8μm) is prone to agglomeration with yttria sintering aids, causing the thermal conductivity fluctuation of sintered substrates to exceed 15% (standard requirement: ≤5%), with the product yield rate merely 70%.
Oxidation risk: Powder exposure to air during mixing leads to oxidation on the aluminum nitride surface and generates Al₂O₃, which reduces the thermal conductivity of finished substrates.
Low efficiency: A single batch mixing takes 2 hours, failing to meet the annual production capacity requirement of 5 million substrates.

Customized Solution
Custom High-Speed Mixer
Model: GN-200H, 200L volume, equipped with double-layer high-speed turbine blades (main blade speed: 0-3000rpm stepless adjustable; auxiliary blade speed: 0-1500rpm).
Nitrogen protection system: Filled with 99.999% high-purity nitrogen throughout the process, with internal oxygen content controlled below 10ppm to isolate air and avoid powder oxidation.
Temperature control module: Built-in cooling jacket keeps the mixing temperature below 40℃ and effectively prevents thermal agglomeration of fine powder.

Process Upgrade
Phased mixing strategy: Low-speed pre-mixing at 800rpm for 30s → high-speed dispersion at 2000rpm for 2min → final homogenization at 1200rpm for 1min.
0.5% nano-silica flow aid is added to optimize powder fluidity and further improve mixing uniformity.

Operation Results
Performance Improvement
The mixing uniformity CV value is reduced from 18% to 2.3%. The thermal conductivity of sintered substrates is stably maintained at 180-185W/(m·K), exceeding the target standard of ≥170W/(m·K).
The powder oxygen content drops from 0.8% to 0.15%, and the product yield rate is increased to 96%.

Efficiency Breakthrough
The single-batch mixing time is shortened to 3.5 minutes, with a daily processing capacity of 80 batches, supporting an annual output of 6 million ceramic substrates.